Henry Chan

Ph.D., University of Illinois at Chicago

Research Interests

• Multi-scale modeling of materials, from the atomistic scale to the continuum scale
• Soft materials, hierarchical self-assembly, nature inspired materials for a circular economy
• Development of computationally efficient yet accurate methodologies for molecular simulations and inverse design problems
• AI/ML based frameworks for materials discovery, imaging, and microstructure characterization
• HPC workflows and data infrastructure for autonomous experimentation and remote operations

Highlights

• Now in 3D: Deep learning techniques help visualize X-ray data in three dimensions
• Capturing 3D microstructures in real time
• Through machine learning, new model holds water
• Blast to the future
• The flat and the curious